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产品信息
FEATURE
Advanced thin film technology.
Excellent overall stability, Cl* 0.25.
Force fitted steel caps. Tin plated on nickel barrier.
Pure Sn termination on Ni Barrier layer.
Compatible with lead (Pb-free) and lead containing soldering processes.
Lead (Pb-free) and RoHS Compliant.
Advanced thin film technology.
Excellent overall stability, Cl* 0.25.
Force fitted steel caps. Tin plated on nickel barrier.
Pure Sn termination on Ni Barrier layer.
Compatible with lead (Pb-free) and lead containing soldering processes.
Lead (Pb-free) and RoHS Compliant.